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HP Pavilion dv6z Artist Edition Notebook

Filed under: by: MY Blogs

HP announced the Pavilion dv6z Artist Edition notebook PC that features the winning design from the 2008 HP MTV Notebook Design Contest – a design inspired by the sea and sky in Okinawa, Japan.

Silicon Image SteelVine Series 3 Core Storage Processors Launch

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Silicon Image launches the new SteelVine Series 3 Core storage processors, including the SiI5923 storage processor and the SiI3723 SATA port multiplier. The new SteelVine Series 3 Core processors offers 38 percent faster performance and consume 33 percent less power compared to the prior SteelVine products.

These new storage processors will be shipped starting in August 2009.

Key features of the SiI5923 SteelVine Series 3 Core storage processor:

Key features of the SiI3723 SteelVine Series 3 Core SATA port multiplier:

  • One host and two device ports
  • Storage SATA port multiplier
  • eSATA compatible device ports
  • Automatic down shift to Gen 1
  • LED pins for each PHY
  • Enhanced performance option

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Ralink RT3350 and RT3390 - World’s Most Integrated 802.11n Chipsets

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Ralink announced the RT3350 router-on-a-chip and RT3390 NetBook client that are the world’s most integrated 802.11n chipsets. These chips offer high performance, low power consumption at an attractive pricing.

The RT3350 router-on-a-chip integrates 802.11n media access controller (MAC) and baseband, a 2.4GHz radio, a 320 MHz MIPS 24K CPU core, a 5-port Fast Ethernet switch and physical layer devices (PHYs), various options for system memory, and a high-performance power amplifier. It includes everything needed to build a router and is the only solution available with interfaces capable of incorporating a 3.5G modem.

The RT3390, on the other hand, is a cost-reduced 802.11n PCIe client solution that delivers 7X throughput and up to 30% better range compared to legacy 802.11g devices in NetBooks and full-featured laptops. It features 2.4GHz power amplifier and low noise amplifier, power detector, transmit and receive switch, and diplexers in a miniature package that measures only 8mm x 8mm.

These chipsets will be shipped in Q4 2009.

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